型号/品牌/封装
品类/描述
库存
价格(含税)
资料
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描述:
Conn Unshrouded Header HDR 30POS 2.54mm Solder RA Thru-Hole Tube
2397
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描述:
Conn Unshrouded Header HDR 22POS 2.54mm Solder RA Thru-Hole Tube
8969
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描述:
2.54毫米（ .100“ ）间距SL ™绝缘位移连接器组件，男，单列， D型，背部肋骨，电线尺寸22 ， 0.38μm （ 15μ ”），金（Au ） ， 21电路 2.54mm (.100") Pitch SL™ Insulation Displacement Connector Assembly, Male, Single Row, Version D, Back Ribs, for Wire Size 22, 0.38μm (15μ") Gold (Au), 21 Circuits
5768
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描述:
2.54毫米（ .100 ） C- SL网格™单列，女，版本G插座，电路25 2.54mm (.100) C-Grid SL™ Single Row, Female, Version G Receptacle, 25 Circuits
1587
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描述:
2.54毫米（ .100 ）间距C- Grid®头，通孔，双排，垂直，高温，罩，用PEG ， 6电路，锡（Sn ）镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating
6765
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描述:
2.54毫米（ .100 ）间距C- Grid®头，通孔，双排，垂直，高温，罩，用PEG ， 8回路，锡（Sn ）镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 8 Circuits, Tin (Sn) Plating
1017
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描述:
2.54毫米（ .100 ）间距C- Grid®头，通孔，双排，垂直，高温，罩，用PEG ， 30电路，锡（Sn ）镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 30 Circuits, Tin (Sn) Plating
7739
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描述:
2.54毫米（ .100 ）间距C- Grid®头，通孔，双排，垂直，高温，罩，用PEG ， 10电路， 0.76μm （ 30μ ），金（Au ）选择性电镀，锡（Sn ） PC尾电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
3604
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描述:
2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 20电路， 0.38μm （ 15μ ）金（ Au）的选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2697
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描述:
2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 28电路， 0.38μm （ 15μ ），金（Au ）选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
3536
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描述:
2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温，电路36 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits
6154
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描述:
2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温，电路40 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits
7328
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描述:
2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 56电路，锡（Sn ）镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 56 Circuits, Tin (Sn) Plating
7002
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描述:
Conn Shrouded Header HDR 48POS 2.54mm Solder ST Thru-Hole Tube
6467
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描述:
2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 6电路，锡（Sn ）镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
9512
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描述:
2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 6电路，锡（Sn ）镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
6542
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描述:
2.54毫米（ .100 ）间距C- Grid®头，通孔无钉，双排，垂直，罩，高温， 6电路，锡（Sn ）镀层 2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, Tin (Sn) Plating
9006
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描述:
2.54毫米（ .100 ）间距C- Grid®头，表面贴装，双排，垂直， 4回路，锡（Sn ）镀层，无PCB定位器衣夹 2.54mm (.100) Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs
9111
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描述:
2.54毫米（ .100 ）间距C- Grid®头，表面贴装，双排，垂直， 4回路，锡（Sn ）镀层，无PCB定位器衣夹 2.54mm (.100) Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs
1681
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描述:
2.54毫米（ .100 ）间距C- Grid®头，表面贴装，双排，垂直， 42电路， 0.38μm （ 15μ ），金（Au ）选择性电镀 2.54mm (.100) Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 42 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
6552
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描述:
2.54毫米（ .100 ）间距C- Grid®头，表面贴装，双排，垂直， 4回路，锡（Sn ）镀层，无PCB定位器衣夹 2.54mm (.100) Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs
5341
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描述:
2.54毫米（ .100 ）间距C- Grid®头，表面贴装，双排，垂直， 4回路，锡（Sn ）镀层，无PCB定位器衣夹 2.54mm (.100) Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs
6718
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描述:
2.54毫米（ .100 ）间距C- Grid®头，表面贴装，双排，垂直， 4回路，锡（Sn ）镀层，无PCB定位器衣夹 2.54mm (.100) Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs
8620
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描述:
2.54毫米（ .100 ）间距C- Grid®头，表面贴装，双排，垂直， 46电路，锡（Sn ）镀层，具有3.30毫米（ 0.130 “ ） PCB定位器衣夹 2.54mm (.100) Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 46 Circuits, Tin (Sn) Plating, with 3.30mm (.130") PCB Locator Pegs
1399
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描述:
2.54毫米（ .100 ）间距C- Grid®头，表面贴装，双排，垂直， 4回路，锡（Sn ）镀层，无PCB定位器衣夹 2.54mm (.100) Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs
4311
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描述:
2.54毫米（ .100 ）间距C- Grid®头，表面贴装，双排，垂直， 56电路，锡（Sn ）镀层，具有3.30毫米（ 0.130 ） PCB定位器衣夹 2.54mm (.100) Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 56 Circuits, Tin (Sn) Plating, with 3.30mm (.130) PCB Locator Pegs
1185
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描述:
2.54毫米（ .100 ）间距C- Grid®头，表面贴装，双排，垂直， 66电路， 0.38μm （ 15μ ），金（Au ）选择性电镀，与3.30毫米（ 0.130 ） PCB定位器衣夹 2.54mm (.100) Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 66 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with 3.30mm (.130) PCB Locator Pegs
5579
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描述:
2.54毫米（ .100 ）间距C- Grid®头，表面贴装，双排，垂直， 4回路，锡（Sn ）镀层，无PCB定位器衣夹 2.54mm (.100) Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 4 Circuits, Tin (Sn) Plating, without PCB Locator Pegs
5988
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描述:
2.54毫米（ .100 ）间距C- Grid®头，表面贴装，双排，垂直， 64电路， 0.38μm （ 15μ ），金（Au ）选择性电镀，与3.30毫米（ 0.130 ） PCB定位器衣夹 2.54mm (.100) Pitch C-Grid® Header, Surface Mount, Dual Row, Vertical, 64 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with 3.30mm (.130) PCB Locator Pegs
9351
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描述:
2.54毫米（ .100 ）间距C- Grid®头，表面贴装，双排，垂直， 68电路， 0.38μm （ 15μ ），金（Au ）选择性电镀，与3.30毫米（ 0.130 ） PCB定位器衣夹 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 68 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with 3.30mm (.130) PCB Locator Pegs
9691
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